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Ion Beam Milling Equipmentの製品一覧

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Ion Beam Milling Device "scia Mill 150/200"

Ion Beam Milling Device "scia Mill 150/200"

Supports wafers up to 150 or 200 mm! Etching angle and stage tilt/rotation mechanism.

The "scia Mill 150/200" is an ion beam milling device with a microwave ECR source (218mm diameter). The processes include ion beam etching/milling (IBE/IBM), reactive ion beam etching (RIBE), and chemical assist ion beam etching (CAIBE). Please feel free to consult us when needed. 【Features】 ■ Compatible with maximum 150 or 200mm wafer substrates ■ Microwave ECR source (218mm diameter) ■ RF type source (350mm diameter) ■ Etching angle and stage tilt/rotation mechanism *For more details, please refer to the PDF materials or feel free to contact us.

  • Etching Equipment
  • Ion Beam Milling Equipment

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Batch-type ion beam milling device "IM-580 series"

Batch-type ion beam milling device "IM-580 series"

This is an introduction to a batch-type ion milling device that enables both high uniformity and high throughput.

The "IM-580 Series" is a batch-type ion beam milling device suitable for processing large substrates and a large number of pieces. It features a bucket-type ion source with a maximum diameter of φ580. It can accommodate non-standard substrates such as square-shaped substrates, support mixed non-standard substrates, and is compatible with various substrate sizes. We offer free sample processing tailored to your application for the first time. Please contact us regarding wafer sizes, processing quantities, and other inquiries. 【Features】 ■ Maximum φ580 bucket-type ion source ■ Achieves both high uniformity and high throughput ■ Capable of controlling both high and low etching rates ■ Self-rotating stage for wafers (substrates) ■ Compatible with non-standard substrates such as square-shaped substrates, supports mixed non-standard substrates, and is compatible with various substrate sizes ■ Filament-free μ-wave neutralizer (optional) *For more details, please refer to the external link or feel free to contact us.

  • Other machine elements
  • Ion Beam Milling Equipment

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Ion beam milling device

Ion beam milling device

Ion beam milling device

Scia Systems GmbH was established by key staff who developed the software and hard wafers for the ion beam trimming (trimming processing, IBF) equipment IonScan from Roth&Rau AG and MicroSystems GmbH. Scia Systems develops unique and proprietary cutting-edge ion beam and plasma technologies, handling equipment from research and development to mass production.

  • Other processing machines
  • Ion Beam Milling Equipment

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Single-Sheet Ion Beam Milling Device 'IML Series'

Single-Sheet Ion Beam Milling Device 'IML Series'

Introducing a sheet-type ion milling device capable of controlling high and low rate etching.

The "IML Series" is a sheet-type ion beam milling device that processes from cassette to cassette. It allows for high-rate etching and low-rate control. Additionally, devices with two processing chambers are also available. We offer free initial sample processing tailored to your application. For inquiries regarding wafer sizes, processing quantities, and more, please contact us. 【Features】 ■ High-rate etching and low-rate control are possible ■ Filamentless μ-wave neutralizer (optional) ■ EPD (endpoint detector) installation (optional) ■ Reactive gas compatibility (optional) ■ Filamentless RF bucket-type ion source (optional) *For more details, please refer to the PDF materials or feel free to contact us.

  • Other machine elements
  • Ion Beam Milling Equipment

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Small Ion Beam Milling Device "IM Series"

Small Ion Beam Milling Device "IM Series"

Introducing a compact ion milling device that allows for a variety of rich chucking methods.

The "IM Series" is a compact ion beam milling device suitable for research and development as well as small-scale production. It has a compact footprint and is equipped with an endpoint detection system (optional for load lock). We offer free initial sample processing tailored to your application. Please contact us for information regarding wafer sizes, processing quantities, and more. 【Features】 ■ Capable of high-rate etching and low-rate control ■ Rotating and tilting wafer holder ■ A variety of chucking methods available ■ Compact footprint ■ Equipped with an endpoint detection system (optional for load lock) ■ Filamentless μ-wave neutralizer (optional) *For more details, please refer to the external link or feel free to contact us.

  • Other machine elements
  • Ion Beam Milling Equipment

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